Electronics assembly technology - Endurance test methods for solder joint of area array type package surface mount devices1 Scope This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and

This document is applicable to any city

Note 2: BS EN 15059 is not applicable to snowmobiles

BS EN 16751 can only be used for the bio-based part since it does not address non-bio-based (fossil

which is compliant with this part of ISO 15031

Diaphragm action produced by the capacity of the composite slab (or of the profiled steel sheets at the construction stage) to resist distortion in its own plane is not within the scope of this Part of BS 5950

60° or 85°

Design management

This Technical Specification also supports document registration and retrieval via the federation of documents’ registries (see IHE Cross-Community Access) in terms of individual users to reduce health information extrusion possibilities

Colloidal/self-assembly methods

Extruded inner covering

Guidance for mapping other authentication assurance schemes to the four LoAs

This part of ISO 15117 consists of a bulk density test and a yield locus test giving information on material flow properties