RF4 H2 1000W Fast Desoldering Hot Air GunI. Functional uses 1. The equipment is mainly used for dismantling and welding the surface mount of electronic components Such as: SOIC, CHIP, QFP, PLCC, BGA, etc. 2. Used for disassembly and welding of mobile phone wiring and wiring holder. 3. It can be used for heating, drying, removing paint, removing glue, thawing, bonding, thermal testing and other processes that need heating for heat shrinkable hose and various plastics. II . Packing List

Input Voltage: Type-C DC 5V/2A

If your payment method is different from that commonly used

L connector 60W charger

personalized settings

a PEPNBPon

Supports BGA chip disassembly and assembly of MacBook

Power: 120W (max)

TBK-668 Efficient purification smoking instrument

the surface and adsorption layer are both excellent

which can hold up the empty parts of IC well and aovid the IC breaking when removing black glue

High quality silicone

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